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[IEEE 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - Shanghai (2018.8.8-2018.8.11)] 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - Processes-based Multistep Simulation of Thermal- mechanical Reliability of a 3D-TSV MEMS
Zeng, Qinghua, Chen, Jing, Jin, YufengYear:
2018
Language:
english
DOI:
10.1109/ICEPT.2018.8480793
File:
PDF, 4.20 MB
english, 2018