A novel random void model and its application in predicting...

Applied Physics A: Materials Science & Processing 2011 / 06 Vol. 103; Iss. 4

A novel random void model and its application in predicting void content of composites based on ultrasonic attenuation coefficient

Li Lin, Xiang Zhang, Jun Chen, Yunfei Mu, Ximeng Li
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
103
Language:
english
Pages:
5
DOI:
10.1007/s00339-010-6061-x
Date:
June, 2011
File:
PDF, 579 KB
english, 2011
Conversion to is in progress
Conversion to is failed