![](/img/cover-not-exists.png)
Interface and reliability analysis of Au passivated Cu-Cu fine pitch thermocompression bonding for 3D IC applications
Bonam, Satish, Panigrahi, Asisa Kumar, Kumar, C Hemanth, Vanjari, Siva Rama Krishna, Singh, Shiv GovindYear:
2019
Language:
english
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/TCPMT.2019.2912891
File:
PDF, 1.12 MB
english, 2019