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3D Sidewall Integration of Ultrahigh‐Density Silicon Nanowires for Stacked Channel Electronics
Wu, Xiaoxiang, Ma, Haiguang, Yin, Han, Pan, Danfeng, Wang, Junzhuan, Yu, Linwei, Xu, Jun, Shi, Yi, Chen, KunjiLanguage:
english
Journal:
Advanced Electronic Materials
DOI:
10.1002/aelm.201800627
Date:
April, 2019
File:
PDF, 1.83 MB
english, 2019