[IEEE 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2018.12.4-2018.12.7)] 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) - Mechanics of Copper Wire Bond Failure due to Thermal Fatigue
Manoharan, Subramani, Li, Nga Man Jennifa, Patel, Chandradip, Hunter, Stevan, McCluskey, PatrickYear:
2018
Language:
english
DOI:
10.1109/EPTC.2018.8654436
File:
PDF, 33 KB
english, 2018