A Passive Full-Wave Micromodeling Circuit for Packaging and...

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IEEE Transactions on Microwave Theory and Techniques 2019

A Passive Full-Wave Micromodeling Circuit for Packaging and Interconnection Problems

Dou, Yuhang, Wu, Ke-Li
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Year:
2019
Language:
english
Journal:
IEEE Transactions on Microwave Theory and Techniques
DOI:
10.1109/TMTT.2019.2909023
File:
PDF, 44 KB
english, 2019
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