Design, fabrication, and RF property evaluation of a TGV...

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  • Design, fabrication, and RF property evaluation of a TGV...
Journal of Micromechanics and Microengineering 2019 / 04

Design, fabrication, and RF property evaluation of a TGV interposer for 2.5D RF integration

Cai, Han, Yan, Jun, Ma, Shenglin, Luo, RongFeng, Xia, Yanming, Li, Jiwei, Hu, Liulin, He, Shuwei, Tang, Zhongjun, Jin, Yufeng, Wang, Wei, Chen, Jing
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Language:
english
Journal:
Journal of Micromechanics and Microengineering
DOI:
10.1088/1361-6439/ab1d30
Date:
April, 2019
File:
PDF, 1.54 MB
english, 2019
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