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[IEEE 2018 7th Electronic System-Integration Technology Conference (ESTC) - Dresden (2018.9.18-2018.9.21)] 2018 7th Electronic System-Integration Technology Conference (ESTC) - Spatially Resolved, Non-Destructive in-situ Detection of Interface Degradation by Remote Electrical Readout of an on-chip Thermal Pixel (Thixel) Matrix
Wunderle, Bernhard, May, Daniel, Ras, Mohmad Abo, Grosse, Corinna, Wohrmann, Markus, Bader, Volker, Keller, JurgenYear:
2018
Language:
english
DOI:
10.1109/ESTC.2018.8546437
File:
PDF, 834 KB
english, 2018