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[IEEE 2018 15th International Conference on Electrical Engineering/Electronics, Computer, Telecommunications and Information Technology (ECTI-CON) - Chiang Rai, Thailand (2018.7.18-2018.7.21)] 2018 15th International Conference on Electrical Engineering/Electronics, Computer, Telecommunications and Information Technology (ECTI-CON) - Optimization Parameters of Installation Automatic Die Bonding Machine for Integrated Circuit Packaging
Nanthavittayaporn, Tanatpol, Ugsornrat, Kessararat, Klaitabtim, Don, Buathong, PirapatYear:
2018
DOI:
10.1109/ECTICon.2018.8620009
File:
PDF, 226 KB
2018