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Effect of Cu, Ag on the microstructure and IMC evolution of Sn5Sb-CuAgNi /Cu solder joints
Han, Bangyao, Sun, Fenglian, Ban, Gaofang, Liu, Yang, Liu, Yang, Li, Tianhui, Pang, ShushuiLanguage:
english
Journal:
Materials Research Express
DOI:
10.1088/2053-1591/ab1f4a
Date:
May, 2019
File:
PDF, 2.48 MB
english, 2019