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Bi‐Facial Substrates Enabled Heterogeneous Multi‐Dimensional Integrated Circuits (MD‐IC) for Internet of Things (IoT) Applications
El‐Atab, Nazek, Shaikh, Sohail F., Khan, Sherjeel M., Hussain, Muhammad M.Language:
english
Journal:
Advanced Engineering Materials
DOI:
10.1002/adem.201900043
Date:
April, 2019
File:
PDF, 775 KB
english, 2019