Thermomigration in Co/SnAg/Co and Cu/SnAg/Co sandwich...

Microelectronics Reliability 2019 / 06 Vol. 97

Thermomigration in Co/SnAg/Co and Cu/SnAg/Co sandwich structure

Ouyang, Fan-Yi, Hong, Gong-Lin, Hsu, Yuan-Ruei, Mao, Shan-Yu, Liu, Wei-Jun
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Volume:
97
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2019.03.005
Date:
June, 2019
File:
PDF, 2.11 MB
2019
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