Investigation on residual scratch depth and material...

Materials Science in Semiconductor Processing 2019 / 09 Vol. 100

Investigation on residual scratch depth and material removal rate of scratching machining single crystal silicon with Berkovich indenter

Ge, Mengran, Zhu, Hongtao, Ge, Peiqi, Zhang, Cheng
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Volume:
100
Language:
english
Journal:
Materials Science in Semiconductor Processing
DOI:
10.1016/j.mssp.2019.04.037
Date:
September, 2019
File:
PDF, 1.20 MB
english, 2019
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