Toward near-bulk resistivity of Cu for next-generation...

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Carbon 2019 / 4

Toward near-bulk resistivity of Cu for next-generation nano-interconnects: Graphene-coated Cu

Lee, Hyo Chan, Jo, Mankyu, Lim, Hyungsub, Yoo, Min Seok, Lee, Eunho, Nguyen, Nguyen Ngan, Han, Sang Youn, Cho, Kilwon
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Journal:
Carbon
DOI:
10.1016/j.carbon.2019.04.101
Date:
April, 2019
File:
PDF, 3.07 MB
2019
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