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Solid-State Electronics 2019 / 5

Interface State Degradation during AC Positive Bias Temperature Instability Stress

Kang, Soo Cheol, Kim, Seung Mo, Jung, Ukjin, Kim, Yonghun, Park, Woojin, Hun Lee, Byoung
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Language:
english
Journal:
Solid-State Electronics
DOI:
10.1016/j.sse.2019.05.006
Date:
May, 2019
File:
PDF, 744 KB
english, 2019
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