![](/img/cover-not-exists.png)
[IEEE 2018 IEEE 38th International Electronics Manufacturing Technology Conference (IEMT) - Melaka (2018.9.4-2018.9.6)] 2018 IEEE 38th International Electronics Manufacturing Technology Conference (IEMT) - Investigation on Solder Void Formation Mechanism After High Temperatures Stress by 3D CT Scan and EDX Analysis
Yung, Lai Chin, Hong, Ho Ing, Soon Kiong, Eric Wong, Fei, Cheong ChokeYear:
2018
DOI:
10.1109/IEMT.2018.8511764
File:
PDF, 477 KB
2018