A failure criterion for debonding between encapsulants and...

Journal of Adhesion Science and Technology 2000 / 01 Vol. 14; Iss. 1

A failure criterion for debonding between encapsulants and leadframes in plastic IC packages

Yi, Sung, Shen, Lianxi, Kim, Jang Kyo, Yue, Chee Yoon
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Volume:
14
Language:
english
Journal:
Journal of Adhesion Science and Technology
DOI:
10.1163/156856100742122
Date:
January, 2000
File:
PDF, 410 KB
english, 2000
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