Porous Silicone Polymeric Composites Filled with Hollow Silica Particles: Thermal Conductivity, Thermal Stability and Mechanical Properties
Kwak, Bo Min, Park, Soon Young, Chung, Chanhong, Kwon, YounghwanVolume:
19
Language:
english
Journal:
Journal of Nanoscience and Nanotechnology
DOI:
10.1166/jnn.2019.17052
Date:
October, 2019
File:
PDF, 1013 KB
english, 2019