A Thermal Model of an IGBT Module Taking into Account...

Russian Electrical Engineering 2019 / 1 Vol. 90; Iss. 1

A Thermal Model of an IGBT Module Taking into Account Thermal Interconnections between Chips

Ilyin, M. V., Vilkov, E. A., Gulyaev, I. V.
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Volume:
90
Language:
english
Journal:
Russian Electrical Engineering
DOI:
10.3103/S106837121901005X
Date:
January, 2019
File:
PDF, 870 KB
english, 2019
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