Microstructure and Grain Orientation Evolution in...

Materials 2019 / 05 Vol. 12; Iss. 10

Microstructure and Grain Orientation Evolution in SnPb/SnAgCu Interconnects Under Electrical Current Stressing at Cryogenic Temperature

Fu, Xing, En, Yunfei, Zhou, Bin, Chen, Si, Huang, Yun, He, Xiaoqi, Chen, Hongtao, Yao, Ruohe
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Volume:
12
Language:
english
Journal:
Materials
DOI:
10.3390/ma12101593
Date:
May, 2019
File:
PDF, 4.16 MB
english, 2019
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