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Advanced Statistical Model Calibration to Determine Manufacturing-Induced Variations of Effective Elastic Properties of SAC Solder Joints in Leadless Chip Resistor Assemblies
Wei, Hsiu-Ping, Yang, Yu-Hsiang, Han, BongtaeVolume:
9
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/TCPMT.2018.2874638
Date:
April, 2019
File:
PDF, 34 KB
2019