Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures
2019 / 05 Vol. 37; Iss. 3
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CuAl 2 thin films as a low-resistivity interconnect material for advanced semiconductor devices
Chen, Linghan, Ando, Daisuke, Sutou, Yuji, Koike, JunichiVolume:
37
Language:
english
Journal:
Journal of Vacuum Science & Technology B
DOI:
10.1116/1.5094404
Date:
May, 2019
File:
PDF, 1.72 MB
english, 2019