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Journal of Materials Research and Technology 2019 / 5

Organic ligand capping of CuI for enhanced electrical and ionic conductivity

Sherine, Jositta, Indubala, Emayavaramban, Rajagopal, Revathy, Harinipriya, Seshadri
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Journal:
Journal of Materials Research and Technology
DOI:
10.1016/j.jmrt.2019.03.012
Date:
May, 2019
File:
PDF, 2.26 MB
2019
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