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Residual Stress and In-situ Thermal Stress Measurements of Copper Films on Glass Substrate
HANABUSA, Takao, NISHIDA, MasayukiVolume:
50
Year:
2001
Language:
english
Journal:
Journal of the Society of Materials Science, Japan
DOI:
10.2472/jsms.50.3Appendix_54
File:
PDF, 3.17 MB
english, 2001