Growth behavior of intermetallic compounds on...

Materials Letters 2019 / 10 Vol. 252

Growth behavior of intermetallic compounds on Sn-10Bi-0.7Cu-0.15Co/Co interface under multiple reflows

Gao, He, Wei, Fuxiang, Lin, Caixia, Shu, Tie, Sui, Yanwei, Qi, Jiqiu, Zhang, Xuping
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Volume:
252
Language:
english
Journal:
Materials Letters
DOI:
10.1016/j.matlet.2019.05.100
Date:
October, 2019
File:
PDF, 2.16 MB
english, 2019
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