Thin Ti adhesion layer breaks bottleneck to hot hole relaxation in Au films
Zhou, Xin, Tokina, Marina V., Tomko, John A., Braun, Jeffrey L., Hopkins, Patrick E., Prezhdo, Oleg V.Volume:
150
Journal:
The Journal of Chemical Physics
DOI:
10.1063/1.5096901
Date:
May, 2019
File:
PDF, 3.68 MB
2019