Electroless Bismuth Plating as a Peripheral Technology for SiC Power Devices
Uchida, Ei, Tanaka, Kaoru, Okada, Miri, Tsuruoka, Takaaki, Akamatsu, Kensuke, Nawafune, HidemiVolume:
39
Year:
2014
Language:
english
Journal:
Transactions of the Materials Research Society of Japan
DOI:
10.14723/tmrsj.39.47
File:
PDF, 924 KB
english, 2014