[IEEE 2019 20th International Conference on Thermal,...

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[IEEE 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Hannover, Germany (2019.3.24-2019.3.27)] 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Simulative Comparison of Polymer and Ceramic Encapsulation on SiC-MOSFET Power Modules under Thermomechanical Load

Wagner, Felix, Maniar, Youssef, Rittner, Martin, Kaessner, Stefan, Guyenot, Michael, Lang, Lukas, Wunderle, Bernhard
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Year:
2019
Language:
english
DOI:
10.1109/EuroSimE.2019.8724587
File:
PDF, 34 KB
english, 2019
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