[IEEE 2018 IEEE 10th International Conference on Humanoid,...

[IEEE 2018 IEEE 10th International Conference on Humanoid, Nanotechnology, Information Technology,Communication and Control, Environment and Management (HNICEM) - Baguio City, Philippines (2018.11.29-2018.12.2)] 2018 IEEE 10th International Conference on Humanoid, Nanotechnology, Information Technology,Communication and Control, Environment and Management (HNICEM) - FEA of Thermal Warpage in Ball Grid Array with Consideration of Molding Compound Residual Strain Compared to Experimental Measurements

Lim, Nino Rigo Emil, Dimagiba, Richard, Ubando, Aristotle, Gonzaga, Jeremias, Augusto, Gerardo

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Year:

2018

Language:

english

DOI:

10.1109/HNICEM.2018.8666377

File:

PDF, 195 KB

english, 2018

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