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IEEE Transactions on Components Packaging and Manufacturing Technology 2019

Modeling of Capacitive Resonant Wireless Power and Data Transfer to Deep Biomedical Implants

R, Narayanamoorthi
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Year:
2019
Language:
english
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/TCPMT.2019.2922046
File:
PDF, 1.92 MB
english, 2019
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