The Effect of Bismuth on Intermetallics Growth between...

Key Engineering Materials 2019 / 3 Vol. 796

The Effect of Bismuth on Intermetallics Growth between Lead-Free Solders and Electroless Nickel Immersion Silver (ENIMAG) Surface Finish

Zolhafizi, Jaidi, Azlina, Osman Saliza
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Volume:
796
Language:
english
Journal:
Key Engineering Materials
DOI:
10.4028/www.scientific.net/KEM.796.183
Date:
March, 2019
File:
PDF, 1.65 MB
english, 2019
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