Triple-Stacked Au/SiO2 Hybrid Bonding with 6-μm-pitch Au...

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IEEE Transactions on Components Packaging and Manufacturing Technology 2019

Triple-Stacked Au/SiO2 Hybrid Bonding with 6-μm-pitch Au Electrodes on Silicon-On-Insulator Substrates using O2 Plasma Surface Activation for Three-Dimensional Integration

Honda, Yuki, Goto, Masahide, Watabe, Toshihisa, Hagiwara, Kei, Nanba, Masakazu, Iguchi, Yoshinori, Saraya, Takuya, Kobayashi, Masaharu, Higurashi, Eiji, Toshiyoshi, Hiroshi, Hiramoto, Toshiro
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Year:
2019
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/TCPMT.2019.2910863
File:
PDF, 9 KB
2019
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