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Thermal Characterization of a Heat Management Module Containing Microencapsulated Phase Change Material
Shih, H.M., Lin, Yi-Pin, Lin, L.P., Lai, Chi-MingVolume:
12
Language:
english
Journal:
Energies
DOI:
10.3390/en12112164
Date:
June, 2019
File:
PDF, 3.63 MB
english, 2019