Erratum: “Solder Joint Shape Prediction Using a Modified...

Erratum: “Solder Joint Shape Prediction Using a Modified Perzyna Viscoplastic Model” [Journal of Electronic Packaging, 2005, 127(3), pp. 290–298]

Ahmad, Mudasir, Hubbard, Ken, Hu, Mason
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Volume:
128
Year:
2006
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.2165648
File:
PDF, 162 KB
2006
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