Erratum: “Solder Joint Shape Prediction Using a Modified Perzyna Viscoplastic Model” [Journal of Electronic Packaging, 2005, 127(3), pp. 290–298]
Ahmad, Mudasir, Hubbard, Ken, Hu, MasonVolume:
128
Year:
2006
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.2165648
File:
PDF, 162 KB
2006