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[ASME ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - San Francisco, California, USA (Monday 27 August 2018)] ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - Copper, Silver, and PCC Wirebonds Reliability in Automotive Underhood Environments
Lall, Pradeep, Deshpande, Shantanu, Nguyen, LuuYear:
2018
Language:
english
DOI:
10.1115/IPACK2018-8358
File:
PDF, 4.48 MB
english, 2018