Connectivity Test for System in Package Interconnects

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Connectivity Test for System in Package Interconnects

Kang, JungHo, Chae, Kyungsoo, Jeong, Jaeyoun
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Language:
english
Journal:
Journal of Electronic Testing
DOI:
10.1007/s10836-019-05810-2
Date:
June, 2019
File:
PDF, 907 KB
english, 2019
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