Evolution of etch profile of copper thin films in high...

Vacuum 2019 / 09 Vol. 167

Evolution of etch profile of copper thin films in high density plasmas of alcohol-based gases

Lim, Eun Taek, Ryu, Jin Su, Choi, Jae Sang, Chung, Chee Won
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Volume:
167
Language:
english
Journal:
Vacuum
DOI:
10.1016/j.vacuum.2019.05.046
Date:
September, 2019
File:
PDF, 2.84 MB
english, 2019
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