Effect of Soldier Bump Size On Interfacial Reactions During...

Jurnal Teknologi 2010 / 05 Vol. 52; Iss. 1

Effect of Soldier Bump Size On Interfacial Reactions During Soldering Between PB–Free Solder and Cu and Cu Ni/Pd/Au Surface Finishes

Fadil, Nor Akmal, Ourdjini, Ali, Mohamed Ariff, Azmah Hanim, Idris, Siti Rabiatul Aisha
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Volume:
52
Language:
english
Journal:
Jurnal Teknologi
DOI:
10.11113/jt.v52.118
Date:
May, 2010
File:
PDF, 10.55 MB
english, 2010
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