Substructure of Intermetallic Thin-Film Cu3Sn

Substructure of Intermetallic Thin-Film Cu3Sn

Mokrushina, A. N., Plotnikov, V. A., Dem’yanov, B. F., Makarov, S. V.
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Volume:
64
Language:
english
Journal:
Technical Physics
DOI:
10.1134/S1063784219060112
Date:
June, 2019
File:
PDF, 1.49 MB
english, 2019
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