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[IEEE 2019 International Conference on Electronics Packaging (ICEP) - Niigata, Japan (2019.4.17-2019.4.20)] 2019 International Conference on Electronics Packaging (ICEP) - Influence of Grain Refinement on Direct Bonding for Electrodeposited Copper
Xie, Zong-Yu, Yu, I-You, Song, Jenn-Ming, Tarng, David, Hung, Chih-PinYear:
2019
Language:
english
DOI:
10.23919/ICEP.2019.8733455
File:
PDF, 2.24 MB
english, 2019