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[IEEE 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Hannover, Germany (2019.3.24-2019.3.27)] 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Degradation Prediction of Electronic Packages using Machine Learning
Prisacaru, Alexandru, Guerrero, Ernesto Oquelis, Gromala, Przemyslaw Jakub, Han, Bongtae, Zhang, Guo QiYear:
2019
DOI:
10.1109/EuroSimE.2019.8724523
File:
PDF, 36 KB
2019