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[ACM Press the 2019 - Tysons Corner, VA, USA (2019.05.09-2019.05.11)] Proceedings of the 2019 on Great Lakes Symposium on VLSI - GLSVLSI '19 - An Overview of Thermal Challenges and Opportunities for Monolithic 3D ICs
Shukla, Prachi, Coskun, Ayse K., Pavlidis, Vasilis F., Salman, EmreYear:
2019
Language:
english
DOI:
10.1145/3299874.3319485
File:
PDF, 5.31 MB
english, 2019