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[IEEE 2019 IEEE Applied Power Electronics Conference and Exposition (APEC) - Anaheim, CA, USA (2019.3.17-2019.3.21)] 2019 IEEE Applied Power Electronics Conference and Exposition (APEC) - Simplified Multi-time Scale Thermal Model Considering Thermal Coupling in IGBT Modules
Zhang, Yi, Wang, Huai, Wang, Zhongxu, Blaabjerg, FredeYear:
2019
Language:
english
DOI:
10.1109/APEC.2019.8721898
File:
PDF, 3.34 MB
english, 2019