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[IEEE 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Hannover, Germany (2019.3.24-2019.3.27)] 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Electromigration Effects in Corroded BGA
Weide-Zaage, Kirsten, Guedon-Gracia, Alexandrine, Fremont, HeleneYear:
2019
Language:
english
DOI:
10.1109/EuroSimE.2019.8724522
File:
PDF, 431 KB
english, 2019