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[IEEE 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Hannover, Germany (2019.3.24-2019.3.27)] 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Modeling temperature dependent chemical reaction of intermetallic compound growth
Morozov, A., Freidin, A., Muller, W.H., Semencha, A., Tribunskiy, M.Year:
2019
Language:
english
DOI:
10.1109/EuroSimE.2019.8724531
File:
PDF, 33 KB
english, 2019