[IEEE 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Hannover, Germany (2019.3.24-2019.3.27)] 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Numerical estimation of local load during manufacturing process in high temperature PCB resin based on viscoelastic material modeling
Schmidt, M., Maniar, Y., Ratchev, R., Kabakchiev, A., Guyenot, M., Walter, H., Schneider-Ramelow, M.Year:
2019
Language:
english
DOI:
10.1109/EuroSimE.2019.8724534
File:
PDF, 627 KB
english, 2019
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