[IEEE 2019 20th International Conference on Thermal,...

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[IEEE 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Hannover, Germany (2019.3.24-2019.3.27)] 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Direct Measurements of Underfill Local Strain Using Confocal Microscopy and Digital Image Correlation

Yang, Ying, Souare, Papa Momar, Sylvestre, Julien
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Year:
2019
DOI:
10.1109/EuroSimE.2019.8724546
File:
PDF, 239 KB
2019
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