[IEEE 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Hannover, Germany (2019.3.24-2019.3.27)] 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Prediction of robustness of packages by cohesive zone finite element simulation and verification by non-destructive tests
Pufall, Reinhard, May, Daniel, Wunderle, Bernhard, Reuther, Georg M., Pflugler, Nadine, Udiljak, DominikYear:
2019
Language:
english
DOI:
10.1109/EuroSimE.2019.8724551
File:
PDF, 625 KB
english, 2019