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[IEEE 2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Kanazawa, Japan (2019.5.21-2019.5.25)] 2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Low Temperature Cu-Cu Gang Bonding for RDL-First Fan-Out Panel Level Package
Yang, Kai-Ming, Chou, Tzu-Chieh, Ko, Cheng-Ta, Lin, Chen-Hao, Chen, Yu-Hua, Tseng, Tzyy-Jang, Wu, Wen-Wei, Chen, Kuan-NengYear:
2019
Language:
english
DOI:
10.23919/LTB-3D.2019.8735260
File:
PDF, 526 KB
english, 2019