[IEEE 2019 Symposium on Design, Test, Integration &...

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[IEEE 2019 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP) - Paris, France (2019.5.12-2019.5.15)] 2019 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP) - Design and Analyses of New Configured Vertical Electro-Thermal Microactuators

Voicu, Rodica-Cristina, Pustan, Marius, Birleanu, Corina, Tibeica, Catalin, Simionescu, Octavian, Avram, Andrei
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Year:
2019
Language:
english
DOI:
10.1109/DTIP.2019.8752781
File:
PDF, 1.21 MB
english, 2019
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